1. It is reported that TSMC has won a large order for SK Hynix chips in collaboration with Creative Electronics. 2. AMD Ryzen AI Pro 300 series is exposed, with a 12-core CPU. 3. Samsung and SK Hynix will use hybrid bonding technology in the new generation of HBM. 4. Sun Moonlight announced the construction of a K28 factory in Kaohsiung to meet the needs of advanced packaging and testing. 5. Three central automobile enterprises (FAW, Dongfeng, Changan) used 132 million domestic automotive chips ...